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Issues

Volume 121, Issue 4
December 1999
Journal of Electronic Packaging Cover Image for Volume 121, Issue 4
ISSN 1043-7398
EISSN 1528-9044
In this Issue

Editorial Paper

Modeling of the Mechanical Behavior of Materials in “High-Tech” Systems: Attributes and Review
E. Suhir
J. Electron. Packag. December 1999, 121(4): 213–221. doi: https://doi.org/10.1115/1.2793843
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Topics: Mechanical behavior , Modeling , Mathematics , Microelectronic devices , Optical fiber , Photonics

Technical Papers

Thermal Management in Direct Chip Attach Assemblies
D. F. Baldwin, J. T. Beerensson
J. Electron. Packag. December 1999, 121(4): 222–230. doi: https://doi.org/10.1115/1.2793844
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Topics: Thermal management , Adhesives , Electronics , Anisotropy , Design , Energy dissipation , Flip-chip , Flip-chip assemblies , Flip-chip devices , Junctions
Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 1—Without Underfill
K. Darbha, J. H. Okura, A. Dasgupta
J. Electron. Packag. December 1999, 121(4): 231–236. doi: https://doi.org/10.1115/1.2793845
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Topics: Durability , Flip-chip devices , Solders , Thermomechanics , Flip-chip , Damage , Stress , Stress analysis (Engineering) , Finite element model , Modeling
Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2—With Underfill
K. Darbha, J. H. Okura, S. Shetty, A. Dasgupta, T. Reinikainen, J. Zhu, J. F. J. M. Caers
J. Electron. Packag. December 1999, 121(4): 237–241. doi: https://doi.org/10.1115/1.2793846
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Topics: Durability , Flip-chip , Flip-chip devices , Solders , Thermomechanics , Fatigue , Finite element model , Solder joints , Architecture , Cycles
Effect of Heat-Spreader Sizes on the Thermal Performance of Large Cavity-Down Plastic Ball Grid Array Packages
J. Lau, T. Chen, S.-W. R. Lee
J. Electron. Packag. December 1999, 121(4): 242–248. doi: https://doi.org/10.1115/1.2793847
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Topics: Ball-Grid-Array packages , Cavities , Flat heat pipes , Ball-Grid-Array packaging , Cooling , Epoxy adhesives , Epoxy resins , Glass , Printed circuit boards , Solders
Alternative Curing Methods for FCOB Underfill
M. M. Merton, C. P. Malhotra, N. Nikmanesh, R. L. Mahajan
J. Electron. Packag. December 1999, 121(4): 249–254. doi: https://doi.org/10.1115/1.2793848
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Topics: Hardening (Curing) , Condensation , Failure mechanisms , Heat transfer , Vapors , Delamination , Failure , Fatigue failure , Flip-chip , Heating
Flow-Field Prediction in Submerged and Confined Jet Impingement Using the Reynolds Stress Model
G. K. Morris, S. V. Garimella, J. A. Fitzgerald
J. Electron. Packag. December 1999, 121(4): 255–262. doi: https://doi.org/10.1115/1.2793849
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Topics: Flow (Dynamics) , Stress , Nozzles , Reynolds number , Confined flow , Errors , Flow visualization , Outflow , Renormalization (Physics)
Thermoelastic Modeling of a PWB With Simulated Circuit Traces Subjected to Infrared Reflow Soldering With Experimental Validation
Y. Polsky, I. C. Ume
J. Electron. Packag. December 1999, 121(4): 263–270. doi: https://doi.org/10.1115/1.2793850
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Topics: Circuits , Modeling , Printed circuit boards , Reflow soldering , Thermoelasticity , Warping , Copper , Elasticity , Lamination , Micromechanics (Engineering)
Investigation of a New Lead Free Solder Alloy Using Thin Strip Specimens
W. Ren, Z. Qian, M. Lu, S. Liu, D. Shangguan
J. Electron. Packag. December 1999, 121(4): 271–274. doi: https://doi.org/10.1115/1.2793851
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Topics: Alloys , Lead-free solders , Strips , Fatigue , Computers , Creep , Electronic packaging , Solders , Testing , Thermomechanics
Determination of Fracture Toughness for Metal/Polymer Interfaces
V. Sundararaman, S. K. Sitaraman
J. Electron. Packag. December 1999, 121(4): 275–281. doi: https://doi.org/10.1115/1.2793852
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Topics: Fracture toughness , Metals , Polymers , Finite element analysis , Fracture (Materials) , Electronic packaging
Consideration of Parameter Scattering in Thermo-Mechanical Characterization of Advanced Packages
T. Winkler, A. Schubert, E. Kaulfersch, B. Michel
J. Electron. Packag. December 1999, 121(4): 282–285. doi: https://doi.org/10.1115/1.2793853
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Topics: Electromagnetic scattering , Thermomechanics , Finite element analysis , Uncertainty , Simulation , Chaos , Electronic packages , Materials properties , Modeling , Optimization
A Statistical Mechanical Model of Electrical Carbon Fiber Contacts
J. Xie, M. Pecht, A. Dasgupta, J. A. Swift, S. J. Wallace
J. Electron. Packag. December 1999, 121(4): 286–290. doi: https://doi.org/10.1115/1.2793854
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Topics: Carbon fibers , Contact resistance , Fibers , Geometry
Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB)
J. Zhang, C. Q. Cui, T. B. Lim, E. T. Kang
J. Electron. Packag. December 1999, 121(4): 291–296. doi: https://doi.org/10.1115/1.2793855
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Topics: Copper , Epoxy resins , Lamination , Printed circuit boards , Adhesion , Resins , Plasmas (Ionized gases) , Atomic force microscopy , Polymerization , Temperature
Three-Dimensional Effects of Solder Joints in Micro-Scale BGA Assembly
J. Zhu
J. Electron. Packag. December 1999, 121(4): 297–302. doi: https://doi.org/10.1115/1.2793856
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Topics: Ball-Grid-Array packaging , Manufacturing , Microscale devices , Solder joints , Creep , Design , Solders , Cycles , Modeling , Reliability
An Elastoplastic Beam Model for Column-Grid-Array Solder Interconnects
J. A. Swanson, S. M. Heinrich, P. S. Lee
J. Electron. Packag. December 1999, 121(4): 303–311. doi: https://doi.org/10.1115/1.2793857
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Topics: Solders , Shear (Mechanics) , Deflection , Stiffness , Stress , Deformation , Die cutting , Displacement , Fatigue life , Finite element model
All Issues
Optimization of the reliability of ball grid array solder joints under random vibration conditions using an improved BP neural network-based particle swarm algorithm
J. Electron. Packag
Evaluation of phase transformation on boron decorated Sn-1.5Ag-0.7 Cu joined Cu pillar for packaging connection
J. Electron. Packag
Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems
J. Electron. Packag (September 2025)
Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics
J. Electron. Packag (September 2025)
Submillimeter Reflector for Edge-Emitting Laser Package
J. Electron. Packag (September 2025)
  • Online ISSN 1528-9044
  • Print ISSN 1043-7398

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