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Issues
December 2024
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Special Issue: InterPACK2023
GUEST EDITORIAL
Special Issue on InterPACK2023
J. Electron. Packag. December 2024, 146(4): 040301.
doi: https://doi.org/10.1115/1.4066727
REVIEW ARTICLE
Multiphysics Coupling in IGBT Modules: A Review
J. Electron. Packag. December 2024, 146(4): 040801.
doi: https://doi.org/10.1115/1.4065941
SPECIAL PAPERS
Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multichip Module
J. Electron. Packag. December 2024, 146(4): 041101.
doi: https://doi.org/10.1115/1.4065446
Topics:
Computer simulation
,
Cooling
,
Flow (Dynamics)
,
Heat
,
Heat sinks
,
Multi-chip modules
,
Pressure drop
,
Temperature
,
Fluids
,
Coolants
Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks
Ali Heydari, Ahmad R. Gharaibeh, Mohammad Tradat, Qusai Soud, Yaman Manaserh, Vahideh Radmard, Bahareh Eslami, Jeremy Rodriguez, Bahgat Sammakia
J. Electron. Packag. December 2024, 146(4): 041102.
doi: https://doi.org/10.1115/1.4065537
Topics:
Coolants
,
Cooling
,
Data centers
,
Density
,
Heat
,
Heat exchangers
,
Temperature
,
Fluids
,
Stress
,
Cooling systems
Acoustic Characterization of Integrated Circuits During Operation
J. Electron. Packag. December 2024, 146(4): 041103.
doi: https://doi.org/10.1115/1.4065649
Topics:
Acoustic emissions
,
Acoustics
,
Electronics
,
Integrated circuits
,
Signals
,
Stress
,
Waves
,
Sensors
,
Monitoring systems
Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics
J. Electron. Packag. December 2024, 146(4): 041104.
doi: https://doi.org/10.1115/1.4065944
Topics:
Electronics
,
Flow (Dynamics)
,
Heat transfer
,
Junctions
,
Nozzles
,
Temperature
,
Temperature control
,
Testing
,
Transients (Dynamics)
,
Actuators
Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter
J. Electron. Packag. December 2024, 146(4): 041105.
doi: https://doi.org/10.1115/1.4065863
Topics:
Condensers (steam plant)
,
Cooling systems
,
Fluids
,
Heat
,
Secondary cells
,
Stress
,
Temperature
,
Thermal resistance
,
Pipeline risers
,
Risers (Casting)
Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning
Ali Heydari, Qusai Soud, Mohammad Tradat, Ahmad R. Gharaibeh, Najmeh Fallahtafti, Jeremy Rodriguez, Bahgat Sammakia
J. Electron. Packag. December 2024, 146(4): 041106.
doi: https://doi.org/10.1115/1.4065942
Topics:
Air conditioning
,
Coolants
,
Cooling
,
Temperature
,
Vehicles
,
Stress
,
Heat
,
HVAC equipment
,
Noise (Sound)
,
Flow (Dynamics)
Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics
J. Electron. Packag. December 2024, 146(4): 041107.
doi: https://doi.org/10.1115/1.4065943
Topics:
Coating processes
,
Coatings
,
Copper
,
Plasma spraying
,
Spraying (Coating processes)
,
Sprays
,
Surface roughness
,
Ceramics
,
Electronics
,
Experimental design
Thermal Spreading Resistance of Surface Adjacent Localized Heating-Induced Size Effects in Semiconductors
J. Electron. Packag. December 2024, 146(4): 041108.
doi: https://doi.org/10.1115/1.4065945
Topics:
Heat
,
Heating
,
Phonons
,
Temperature
Electrically Conductive Adhesives in Microelectronics Packaging
J. Electron. Packag. December 2024, 146(4): 041109.
doi: https://doi.org/10.1115/1.4065939
Topics:
Adhesives
,
Fillers (Materials)
,
Anisotropy
,
Particulate matter
Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies
Mostafa Olyaei, Sagar Singh, Kaiying Jiang, Yashraj Gurumukhi, Kenneth Goodson, Mehdi Asheghi, Nenad Miljkovic
J. Electron. Packag. December 2024, 146(4): 041110.
doi: https://doi.org/10.1115/1.4065988
Topics:
Batteries
,
Cycles
,
Temperature
,
Thermal management
,
Cooling
Convection Cooling of Power Electronics Operating in Deep-Space
J. Electron. Packag. December 2024, 146(4): 041111.
doi: https://doi.org/10.1115/1.4065947
Topics:
Design
,
Electronics
,
Fans
,
Forced convection
,
Heat
,
Simulation
,
Temperature
,
Thermal management
,
Packaging
,
Cooling
Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core
Pratik Bansode, Rohit Suthar, Rabin Bhandari, Akshay Lakshminarayana, Naga Tejesh Eda, Gautam Gupta, Vibin Simon, Himanshu Modi, Vivek Nair, Pardeep Shahi, Satyam Saini, Krishna Bhavana Sivaraju, Dereje Agonafer
J. Electron. Packag. December 2024, 146(4): 041112.
doi: https://doi.org/10.1115/1.4066044
Topics:
Cooling
,
Elastic moduli
,
Fluids
,
Temperature
,
Thermomechanics
,
Heat
,
Energy dissipation
,
Glass transition
,
Data centers
,
Reliability
Electrochemical Additive Manufacturing-Based Design of a Heat Sink for Single-Phase Natural Convection Immersion Cooling Application
Jacob Lamotte-Dawaghreh, Joseph Herring, Sai Abhideep Pundla, Rohit Suthar, Vivek Nair, Pratik Bansode, Gautam Gupta, Dereje Agonafer, Joseph Madril, Tim Ouradnik, Michael Matthews, Ian Winfield
J. Electron. Packag. December 2024, 146(4): 041113.
doi: https://doi.org/10.1115/1.4065987
Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition
J. Electron. Packag. December 2024, 146(4): 041114.
doi: https://doi.org/10.1115/1.4065940
Topics:
Capacitance
,
Sensors
,
Temperature
,
Water
,
Simulation
,
Reliability
,
Printing
Thermal Property Estimation of Thin-Layered Structures by Means of Thermoreflectance Measurement and Network Identification by Deconvolution Algorithm
J. Electron. Packag. December 2024, 146(4): 041115.
doi: https://doi.org/10.1115/1.4066086
Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink
J. Electron. Packag. December 2024, 146(4): 041116.
doi: https://doi.org/10.1115/1.4066041
Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers
Pardeep Shahi, Ali Heydari, Bahareh Eslami, Vahideh Radmard, Chandraprakash Hinge, Himanshu Modi, Lochan Sai Reddy Chinthaparthy, Mohammad Tradat, Dereje Agonafer, Jeremy Rodriguez
J. Electron. Packag. December 2024, 146(4): 041117.
doi: https://doi.org/10.1115/1.4065948
Topics:
Cooling
,
Data centers
,
Flow (Dynamics)
,
Manifolds
,
Pressure
,
Pressure drop
,
Temperature
,
Modeling
,
Coolants
,
Calibration
Development of a Thermal Metrology Standard for Evaluation of Cold Plate Thermal Resistance as a Performance Metric
J. Electron. Packag. December 2024, 146(4): 041118.
doi: https://doi.org/10.1115/1.4066101
Topics:
Temperature
,
Thermal resistance
,
Thermocouples
,
Coolants
,
Errors
,
Flow (Dynamics)
,
Heat exchangers
,
Uncertainty
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
J. Electron. Packag. December 2024, 146(4): 041119.
doi: https://doi.org/10.1115/1.4066320
Topics:
Aerosols
,
Cantilevers
,
Durability
,
Extruding
,
Finite element analysis
,
Silver
,
Testing
,
Printing
,
Shock (Mechanics)
,
Strain gages
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
J. Electron. Packag. December 2024, 146(4): 041120.
doi: https://doi.org/10.1115/1.4066480
Topics:
Composite materials
,
Phase change materials
,
Silicones
,
Temperature
,
Particulate matter
,
Testing
,
Cooling
,
Insulation
,
Needles
,
Latent heat
Behavior of Polymeric Substrates and Sintered Silver Printed Hybrid Electronic Assemblies Subject to Extreme Acceleration Levels and Elevated Temperatures
J. Electron. Packag. December 2024, 146(4): 041121.
doi: https://doi.org/10.1115/1.4066833
Topics:
Domes (Structural elements)
,
Shock (Mechanics)
,
Silver
,
Temperature
,
Testing
,
Polysulfone
,
Reliability
Enhancing Mechanical Reliability of Silver-Sintered Joints With Copper Nanowires in High-Power Electronic Devices
J. Electron. Packag. December 2024, 146(4): 041122.
doi: https://doi.org/10.1115/1.4066834
Topics:
Copper
,
Nanowires
,
Reliability
,
Silver
,
Temperature
,
Sinter (Metallurgy)
,
Shear strength
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Enhancing Mechanical Reliability of Silver-Sintered Joints With Copper Nanowires in High-Power Electronic Devices
J. Electron. Packag (December 2024)
Special Issue on InterPACK2023
J. Electron. Packag (December 2024)
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
J. Electron. Packag (December 2024)
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
J. Electron. Packag (December 2024)