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( a ) PCBA board, showing the U203 BGA under investigation, ( b ) package o...
Published Online: July 16, 2024
Fig. 1 ( a ) PCBA board, showing the U203 BGA under investigation, ( b ) package outline drawing, ( c ) experimental test samples for microscopy investigation, ( d ) BGA package assembly components, ( e ) FEA model for the reliability simulation, and ( f ) boundary conditions More about this image found in ( a ) PCBA board, showing the U203 BGA under investigation, ( b ) package o...
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