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Journal Articles

Machine Learning Analysis of Autonomous Vehicle Sensors Under Extreme Conditions in Alaska

Jewoo Park, Nhi V. Quach, Yonghwi Kim, Ruey-Hwa Cheng, Michal Jenco, Chenxi Yin, Alex K. Lee, Yoonjin Won
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2023, 145(4): 044501.
Paper No: EP-23-1039
https://doi.org/10.1115/1.4063486
Published Online: October 5, 2023
View Article titled, Machine Learning Analysis of Autonomous Vehicle Sensors Under Extreme Conditions in Alaska
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Topics: Autonomous vehicles, Drops, Machine learning, Sensors, Temperature, Vehicles
Journal Articles

Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization

Pradeep Lall, Kartik Goyal, Curtis Hill
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021011.
Paper No: EP-22-1029
https://doi.org/10.1115/1.4055986
Published Online: November 23, 2022
View Article titled, Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization
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Topics: Copper, Sintering, Surface mount devices, Electrical resistivity, Printing, Drops, Electronics
Journal Articles

Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer

Kidus Guye, De Dong, Yunseo Kim, Hyoungsoon Lee, Baris Dogruoz, Damena Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041106.
Paper No: EP-21-1120
https://doi.org/10.1115/1.4052465
Published Online: October 13, 2021
View Article titled, Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer
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Topics: Design, Drops, Evaporation, Heat conduction, Heat transfer, Heat transfer coefficients, Optimization, Particle swarm optimization, Shapes, Vapors
Journal Articles

Spray Cooling on Enhanced Surfaces: A Review of the Progress and Mechanisms

Ruina Xu, Gaoyuan Wang, Peixue Jiang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2022, 144(1): 010802.
Paper No: EP-20-1114
https://doi.org/10.1115/1.4050046
Published Online: August 6, 2021
View Article titled, Spray Cooling on Enhanced Surfaces: A Review of the Progress and Mechanisms
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Topics: Cooling, Heat transfer, Sprays, Critical heat flux, Drops
Journal Articles

Numerical Investigation of Shape Effect on Microdroplet Evaporation

Li Shan, Shuai Shuai, Binjian Ma, Zichen Du, Baris Dogruoz, Damena Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041008.
Paper No: EP-19-1038
https://doi.org/10.1115/1.4044962
Published Online: October 18, 2019
View Article titled, Numerical Investigation of Shape Effect on Microdroplet Evaporation
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Topics: Diffusion (Physics), Drops, Evaporation, Vapors, Shapes, Simulation
Journal Articles

Experimental Analysis of a Novel Piezoelectric Jetting System for Micrograms Deposition in Electronic Assemblies

Rajiv L. Iyer, Daryl L. Santos
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031009.
Paper No: EP-17-1012
https://doi.org/10.1115/1.4037144
Published Online: July 14, 2017
View Article titled, Experimental Analysis of a Novel Piezoelectric Jetting System for Micrograms Deposition in Electronic Assemblies
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Topics: Adhesives, Drops, Nozzles, Pistons, Experimental design, Manufacturing, Experimental analysis, Fluids
Journal Articles

Thermally Conductive and Highly Electrically Resistive Grease Through Homogeneously Dispersing Liquid Metal Droplets Inside Methyl Silicone Oil

Shengfu Mei, Yunxia Gao, Zhongshan Deng, Jing Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011009.
Paper No: EP-13-1088
https://doi.org/10.1115/1.4026414
Published Online: January 24, 2014
View Article titled, Thermally Conductive and Highly Electrically Resistive Grease Through Homogeneously Dispersing Liquid Metal Droplets Inside Methyl Silicone Oil
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Topics: Drops, Liquid metals, Silicones, Thermal conductivity
Journal Articles

Humidity-Induced Voltage Shift on MEMS Pressure Sensors

J. Albert Chiou, Mem. ASME, Steven Chen, Jinbao Jiao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 470–474.
https://doi.org/10.1115/1.1615249
Published Online: December 15, 2003
View Article titled, Humidity-Induced Voltage Shift on MEMS Pressure Sensors
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Topics: Bonding, Diaphragms (Mechanical devices), Diaphragms (Structural), Finite element analysis, Microelectromechanical systems, Pressure, Pressure sensors, Silicon, Stress, Surface tension
Journal Articles

A Two-Body Formulation for Solder Joint Shape Prediction

F. P. Renken, G. Subbarayan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 302–308.
https://doi.org/10.1115/1.2792637
Published Online: September 1, 1998
View Article titled, A Two-Body Formulation for Solder Joint Shape Prediction
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Topics: Shapes, Solder joints, Solders, Drops, Ball-Grid-Array packaging, Ceramics, Design, Fatigue life, Finite element analysis, Flip-chip