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Journal Articles

Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition

Pradeep Lall, Hyesoo Jang, Curtis Hill
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041114.
Paper No: EP-24-1002
https://doi.org/10.1115/1.4065940
Published Online: August 17, 2024
View Article titled, Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition
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Topics: Capacitance, Sensors, Temperature, Water, Simulation, Reliability, Printing
Journal Articles

Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers

Pardeep Shahi, Ali Heydari, Bahareh Eslami, Vahideh Radmard, Chandraprakash Hinge, Himanshu Modi, Lochan Sai Reddy Chinthaparthy, Mohammad Tradat, Dereje Agonafer, Jeremy Rodriguez
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041117.
Paper No: EP-24-1030
https://doi.org/10.1115/1.4065948
Published Online: August 17, 2024
View Article titled, Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers
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Topics: Cooling, Data centers, Flow (Dynamics), Manifolds, Pressure, Pressure drop, Temperature, Modeling, Coolants, Calibration
Journal Articles

Acoustic Characterization of Integrated Circuits During Operation

Josef Frankhouse, Changgen Li, Han Hu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041103.
Paper No: EP-24-1036
https://doi.org/10.1115/1.4065649
Published Online: June 20, 2024
View Article titled, Acoustic Characterization of Integrated Circuits During Operation
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Topics: Acoustic emissions, Acoustics, Electronics, Integrated circuits, Signals, Stress, Waves, Sensors, Monitoring systems
Journal Articles

Special Issue on InterPACK2022

Jin Yang, Sukwon Choi, Benjamin Leever, Cheng Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2023, 145(4): 040301.
Paper No: EP-23-1077
https://doi.org/10.1115/1.4063893
Published Online: November 1, 2023
View Article titled, Special Issue on InterPACK2022
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Topics: Aerosols, Artificial intelligence, Cloud computing, Cooling, Cycles, Density, Electric vehicles, Electronic packaging, Electronics, Energy conversion
Journal Articles

Machine Learning Analysis of Autonomous Vehicle Sensors Under Extreme Conditions in Alaska

Jewoo Park, Nhi V. Quach, Yonghwi Kim, Ruey-Hwa Cheng, Michal Jenco, Chenxi Yin, Alex K. Lee, Yoonjin Won
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2023, 145(4): 044501.
Paper No: EP-23-1039
https://doi.org/10.1115/1.4063486
Published Online: October 5, 2023
View Article titled, Machine Learning Analysis of Autonomous Vehicle Sensors Under Extreme Conditions in Alaska
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Topics: Autonomous vehicles, Drops, Machine learning, Sensors, Temperature, Vehicles
Journal Articles

High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors

Alexis Krone, Josh Kasitz, David Huitink, Hannah Alpert, Debbie G. Senesky, Satish Shetty, Gregory Salamo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021115.
Paper No: EP-21-1064
https://doi.org/10.1115/1.4053765
Published Online: March 7, 2022
View Article titled, High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors
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Topics: Gallium, Gallium nitride, Hall effect, High temperature, Sensors, Temperature, Alloys, Reliability
Journal Articles

Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors

Mei-Chien Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2022, 144(2): 020801.
Paper No: EP-21-1008
https://doi.org/10.1115/1.4052069
Published Online: September 24, 2021
View Article titled, Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors
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Topics: Sensors, Bonding, Electronics
Journal Articles

Development of a Precise and Cost-Effective Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center Utilizing Airside Economization

Jimil M. Shah, Roshan Anand, Prabjit Singh, Satyam Saini, Rawhan Cyriac, Dereje Agonafer, Mike Kaler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041103.
Paper No: EP-19-1096
https://doi.org/10.1115/1.4047469
Published Online: June 23, 2020
View Article titled, Development of a Precise and Cost-Effective Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center Utilizing Airside Economization
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Topics: Data centers, Dust, Leakage, Particulate matter, Sensors
Journal Articles

Electrical Joining of Paper-Based Multilayer Magneto-Resistive Sensor Stacks

Meriem Akin, Jennifer Blackburn, Autumn Pratt, Andreas Dietzel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021010.
Paper No: EP-19-1057
https://doi.org/10.1115/1.4046557
Published Online: April 6, 2020
View Article titled, Electrical Joining of Paper-Based Multilayer Magneto-Resistive Sensor Stacks
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Topics: Chain, Joining, Sensors
Journal Articles

Feasibility of Printed Circuit Board-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

Klas Brinkfeldt, Göran Wetter, Andreas Lövberg, Per-Erik Tegehall, Dag Andersson, Jan Strandberg, Johnny Goncalves, Jonas Söderlund, Mikael Kwarnmark
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031010.
Paper No: EP-18-1096
https://doi.org/10.1115/1.4043479
Published Online: May 24, 2019
View Article titled, Feasibility of Printed Circuit Board-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems
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Topics: Sensors, Circuits, Impact testing, Vibration, Polarization (Electricity), Polarization (Light), Polarization (Waves), Reflow soldering
Journal Articles

Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design

Sadegh Khalili, Husam Alissa, Kourosh Nemati, Mark Seymour, Robert Curtis, David Moss, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031004.
Paper No: EP-18-1075
https://doi.org/10.1115/1.4042983
Published Online: April 10, 2019
View Article titled, Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design
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Topics: Air flow, Cooling, Data centers, Design, Exhaust systems, Fans, Leakage, Pressure, Sensors, Temperature
Journal Articles

Diagonal Mode van der Pauw Stress Sensors: Proof of Diagonal-Mode Conjecture

Richard C. Jaeger, Jeffrey C. Suhling, Jun Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2018, 140(4): 044501.
Paper No: EP-18-1013
https://doi.org/10.1115/1.4040829
Published Online: August 3, 2018
View Article titled, Diagonal Mode van der Pauw Stress Sensors: Proof of Diagonal-Mode Conjecture
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Topics: Sensors, Stress
Journal Articles

Fabrication of Multimeasurand Sensor for Monitoring of a Li-Ion Battery

Aaron Knobloch, Chris Kapusta, Jason Karp, Yuri Plotnikov, Jason B. Siegel, Anna G. Stefanopoulou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031002.
Paper No: EP-17-1053
https://doi.org/10.1115/1.4039861
Published Online: May 11, 2018
View Article titled, Fabrication of Multimeasurand Sensor for Monitoring of a Li-Ion Battery
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Topics: Sensors, Manufacturing, Batteries, Design, Temperature
Journal Articles

Special Section on InterPACK 2017—Part 2

Kaushik Mysore, Sreekant Narumanchi, Ercan Dede, Reza Khiabani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2018, 140(2): 020301.
Paper No: EP-18-1012
https://doi.org/10.1115/1.4039963
Published Online: May 9, 2018
View Article titled, Special Section on InterPACK 2017—Part 2
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Topics: Batteries, Density, Electronic packaging, Microelectromechanical systems, Optoelectronic devices, Packaging, Semiconductor wafers, Sensors, Reliability
Journal Articles

Peel-and-Stick Sensors Powered by Directed Radio-Frequency Energy

David Eric Schwartz, Clinton J. Smith, Joseph Lee, Shakthi Priya Gowri, George Daniel, Christopher Lalau-Keraly, Quentin Baudenon, J. R. M. Saavedra
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020904.
Paper No: EP-17-1108
https://doi.org/10.1115/1.4039138
Published Online: May 9, 2018
View Article titled, Peel-and-Stick Sensors Powered by Directed Radio-Frequency Energy
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Topics: Sensors
Journal Articles

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

David Gonzalez Cuadrado, Amy Marconnet, Guillermo Paniagua
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010905.
Paper No: EP-17-1099
https://doi.org/10.1115/1.4039026
Published Online: March 2, 2018
View Article titled, Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips
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Topics: Heat conduction, Heat flux, Heat transfer, Integrated circuits, Interpolation, Optimization, Sensors, Temperature, Temperature sensors, Genetic algorithms
Journal Articles

Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Sven Rzepka, Alexander Otto, Dietmar Vogel, Rainer Dudek
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010903.
Paper No: EP-17-1090
https://doi.org/10.1115/1.4039333
Published Online: March 2, 2018
View Article titled, Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches
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Topics: Electronics, Failure, Reliability, Stress, Temperature, Failure mechanisms, Cycles, Safety, Failure analysis, Simulation
Journal Articles

Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333 ]

Richard C. Jaeger, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. March 2018, 140(1): 017001.
Paper No: EP-17-1111
https://doi.org/10.1115/1.4038735
Published Online: March 2, 2018
View Article titled, Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333 ]
Open the PDF for Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333 ] in another window
Topics: Bridges (Structures), Electrons, Sensors, Silicon, Stress, Wire
Journal Articles

Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits

Leila Choobineh, Jared Jones, Ankur Jain
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020908.
Paper No: EP-16-1140
https://doi.org/10.1115/1.4036404
Published Online: June 12, 2017
View Article titled, Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits
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Topics: Integrated circuits, Sensors, Temperature, Thermal resistance, Thermal analysis
Journal Articles

Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials

Dongliang Zhao, Xin Qian, Xiaokun Gu, Saad Ayub Jajja, Ronggui Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2016, 138(4): 040802.
Paper No: EP-16-1067
https://doi.org/10.1115/1.4034605
Published Online: October 6, 2016
View Article titled, Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials
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Topics: Temperature, Thermal conductivity, Thin films, Transients (Dynamics), Heat, Steady state, Sensors, Bulk solids, Thermoreflectance, Lasers