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Journal Articles

Machine Learning Analysis of Autonomous Vehicle Sensors Under Extreme Conditions in Alaska

Jewoo Park, Nhi V. Quach, Yonghwi Kim, Ruey-Hwa Cheng, Michal Jenco, Chenxi Yin, Alex K. Lee, Yoonjin Won
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2023, 145(4): 044501.
Paper No: EP-23-1039
https://doi.org/10.1115/1.4063486
Published Online: October 5, 2023
View Article titled, Machine Learning Analysis of Autonomous Vehicle Sensors Under Extreme Conditions in Alaska
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Topics: Autonomous vehicles, Drops, Machine learning, Sensors, Temperature, Vehicles
Journal Articles

Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology

Jerzy Szałapak, Konrad Kiełbasiński, Łucja Dybowska-Sarapuk, Jakub Krzeminski, Marian Teodorczyk, Tomasz Kowaluk, Małgorzata Jakubowska
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2021, 143(3): 034501.
Paper No: EP-20-1091
https://doi.org/10.1115/1.4049240
Published Online: January 19, 2021
View Article titled, Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology
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Topics: Carbon, Carbon nanotubes, Electrical resistivity, Graphene, Nanoparticles, Silver, Thermal conductivity, Temperature, Joining, High temperature
Journal Articles

A New Correlation for Subcooled Flow Boiling Heat Transfer in a Vertical Narrow Microchannel

Zengchao Chen, Wei Li, Junye Li, Kan Zhou, Zhaozan Feng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2021, 143(1): 014501.
Paper No: EP-19-1083
https://doi.org/10.1115/1.4046755
Published Online: June 4, 2020
View Article titled, A New Correlation for Subcooled Flow Boiling Heat Transfer in a Vertical Narrow Microchannel
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Topics: Boiling, Flow (Dynamics), Fluids, Heat transfer, Microchannels, Subcooling, Water
Journal Articles

Experimental Description of Information Technology Equipment Reliability Exposed to a Data Center Using Airside Economizer Operating in Recommended and Allowable ASHRAE Envelopes in an ANSI/ISA Classified G2 Environment

Oluwaseun Awe, Jimil M. Shah, Dereje Agonafer, Prabjit Singh, Naveen Kannan, Mike Kaler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2020, 142(2): 024501.
Paper No: EP-19-1015
https://doi.org/10.1115/1.4046556
Published Online: April 6, 2020
View Article titled, Experimental Description of Information Technology Equipment Reliability Exposed to a Data Center Using Airside Economizer Operating in Recommended and Allowable ASHRAE Envelopes in an ANSI/ISA Classified G2 Environment
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Topics: Corrosion, Data centers, Temperature, Contamination, Failure, Reliability
Journal Articles

Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding

Bo Wu, Shuanghai Zhang, Fuliang Wang, Zhuo Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2018, 140(4): 044502.
Paper No: EP-18-1015
https://doi.org/10.1115/1.4040794
Published Online: August 6, 2018
View Article titled, Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding
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Topics: Bonding, Columns (Structural), Flip-chip, Copper, Flip-chip devices
Journal Articles

Diagonal Mode van der Pauw Stress Sensors: Proof of Diagonal-Mode Conjecture

Richard C. Jaeger, Jeffrey C. Suhling, Jun Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2018, 140(4): 044501.
Paper No: EP-18-1013
https://doi.org/10.1115/1.4040829
Published Online: August 3, 2018
View Article titled, Diagonal Mode van der Pauw Stress Sensors: Proof of Diagonal-Mode Conjecture
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Topics: Sensors, Stress
Journal Articles

A Study on Electrical Reliability Criterion on Through Silicon Via Packaging

Ben-Je Lwo, Kuo-Hao Tseng, Kun-Fu Tseng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2016, 138(2): 024501.
Paper No: EP-15-1073
https://doi.org/10.1115/1.4032932
Published Online: March 23, 2016
View Article titled, A Study on Electrical Reliability Criterion on Through Silicon Via Packaging
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Topics: Failure, Packaging, Reliability, Silicon
Journal Articles

Temporary Bonding/Debonding of Silicon Substrates Based on Propylene Carbonate

Zhiyuan Zhu, Min Yu, Lisha Liu, Yufeng Jin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2015, 137(4): 044501.
Paper No: EP-15-1062
https://doi.org/10.1115/1.4031750
Published Online: October 20, 2015
View Article titled, Temporary Bonding/Debonding of Silicon Substrates Based on Propylene Carbonate
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Topics: Adhesives, Bonding, Silicon, Temperature, Shear strength, Ultraviolet radiation
Journal Articles

Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation

Leila Ladani, Ousama Abdelhadi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2015, 137(1): 014501.
Paper No: EP-13-1116
https://doi.org/10.1115/1.4027992
Published Online: October 6, 2014
View Article titled, Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation
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Topics: Intermetallic compounds, Mechanical properties, Nanoindentation, Solder joints, Tin, Mechanical behavior, Size effect, Elastic moduli, Yield strength, Stress
Journal Articles

A New Analytical Method for Calculating Maximum Junction Temperature of Packaged Devices Incorporating the Temperature Distribution at the Base of the Substrate

J. H. L. Ling, A. A. O. Tay
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2015, 137(1): 014502.
Paper No: EP-13-1133
https://doi.org/10.1115/1.4028120
Published Online: October 6, 2014
View Article titled, A New Analytical Method for Calculating Maximum Junction Temperature of Packaged Devices Incorporating the Temperature Distribution at the Base of the Substrate
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Topics: Temperature, Temperature distribution, Finite element analysis, Junctions, Heat
Journal Articles

Fabrication of Anodic Aluminum Oxide Template and Copper Nanowire Surface Fastener

Hiromasa Teshima, Kohei Kojima, Yang Ju
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2014, 136(4): 044501.
Paper No: EP-13-1132
https://doi.org/10.1115/1.4028316
Published Online: September 19, 2014
View Article titled, Fabrication of Anodic Aluminum Oxide Template and Copper Nanowire Surface Fastener
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Topics: Aluminum, Bonding, Manufacturing, Nanowires, Fasteners, Electrical resistance
Journal Articles

Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink

S. Shanmugan, D. Mutharasu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2014, 136(3): 034502.
Paper No: EP-13-1099
https://doi.org/10.1115/1.4027379
Published Online: May 12, 2014
View Article titled, Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink
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Topics: Aluminum, Calibration, Copper, Currents, Heat sinks, Junctions, Light-emitting diodes, Temperature, Thermal resistance, Thin films
Journal Articles

A Note on the Normalized Approach to Simulating Moisture Diffusion in a Multimaterial System Under Transient Thermal Conditions Using ansys 14 and 14.5

Dapeng Liu, Seungbae Park
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2014, 136(3): 034501.
Paper No: EP-13-1094
https://doi.org/10.1115/1.4026661
Published Online: May 5, 2014
View Article titled, A Note on the Normalized Approach to Simulating Moisture Diffusion in a Multimaterial System Under Transient Thermal Conditions Using ansys 14 and 14.5
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Topics: Diffusion (Physics), Simulation, Temperature, Transients (Dynamics), Materials properties
Journal Articles

Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink

Bengt Sundén, Gongnan Xie
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2014, 136(2): 024501.
Paper No: EP-13-1058
https://doi.org/10.1115/1.4026538
Published Online: April 29, 2014
View Article titled, Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink
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Topics: Cooling, Heat, Heat sinks, Strips, Temperature, Thermal analysis, Thermal resistance, Electrical conductance, Invar, Temperature distribution
Journal Articles

Numerical Investigation of Thermal Dissipation on Quad Flat Package With Unattached Heat Spreader

Tong Hong Wang, Yi-Shao Lai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2007, 129(3): 366–370.
https://doi.org/10.1115/1.2753988
Published Online: September 12, 2006
View Article titled, Numerical Investigation of Thermal Dissipation on Quad Flat Package With Unattached Heat Spreader
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Topics: Convection, Density, Energy dissipation, Flat heat pipes, Heat transfer, Temperature
Journal Articles

Efficient Cooling of Multiple Components in a Shielded Circuit Pack

Marc Hodes, Cristian Bolle, Paul Kolodner
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2007, 129(2): 216–218.
https://doi.org/10.1115/1.2721095
Published Online: September 5, 2006
View Article titled, Efficient Cooling of Multiple Components in a Shielded Circuit Pack
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Topics: Circuits, Cooling, Gaskets, Heat sinks, Fins, Electromagnetic interference, Stress, Air flow, Flow (Dynamics)
Journal Articles

Investigations of Board-Level Drop Reliability of Wafer-Level Chip-Scale Packages

Yi-Shao Lai, Chang-Lin Yeh, Ching-Chun Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2007, 129(1): 105–108.
https://doi.org/10.1115/1.2429717
Published Online: June 6, 2006
View Article titled, Investigations of Board-Level Drop Reliability of Wafer-Level Chip-Scale Packages
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Topics: Reliability, Semiconductor wafers, Solder joints, Transient analysis
Journal Articles

A Numerical Study of Transport in a Thermal Interface Material Enhanced With Carbon Nanotubes

Anand Desai, Sanket Mahajan, Ganesh Subbarayan, Wayne Jones, James Geer, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2006, 128(1): 92–97.
https://doi.org/10.1115/1.2161231
Published Online: May 10, 2005
View Article titled, A Numerical Study of Transport in a Thermal Interface Material Enhanced With Carbon Nanotubes
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Topics: Carbon nanotubes, Nanotubes, Temperature, Thermal conductivity, Thermal management
Journal Articles

Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array

Tong Hong Wang, Yi-Shao Lai, Jenq-Dah Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2004, 126(4): 560–564.
https://doi.org/10.1115/1.1827271
Published Online: January 24, 2005
View Article titled, Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array
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Topics: Ball-Grid-Array packaging, Creep, Fatigue, Flip-chip, Materials properties, Reliability, Solders, Thermomechanics, Shear (Mechanics), Finite element analysis
Journal Articles

Finite Element Analysis of Die-Strength Testing Configurations for Thin Wafers

X. K. Sun, X. J. Xin, Z. J. Pei
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2005, 127(2): 189–192.
https://doi.org/10.1115/1.1869510
Published Online: May 4, 2004
View Article titled, Finite Element Analysis of Die-Strength Testing Configurations for Thin Wafers
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Topics: Finite element analysis, Semiconductor wafers, Stress, Testing, Fracture (Materials)