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Keywords: extreme environments
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Journal Articles
Jewoo Park, Nhi V. Quach, Yonghwi Kim, Ruey-Hwa Cheng, Michal Jenco, Chenxi Yin, Alex K. Lee, Yoonjin Won
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2023, 145(4): 044501.
Paper No: EP-23-1039
Published Online: October 5, 2023
... extreme environments machine learning image processing image restoration 11 04 2023 12 09 2023 05 10 2023 1 J. Park and N. V. Quach contributed equally to this paper. International Technical Conference and Exhibition on Packaging and Integration of Electronic...
