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Keywords: lead alloys
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031009.
Published Online: September 23, 2011
... was found to describe the observed behavior with much higher fidelity than the common Johnson–Cook model. 14 09 2010 13 05 2011 23 09 2011 deformation eutectic alloys lead alloys solders tensile strength tin alloys Stephens and Frear [( 31 )] studied the creep behavior...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021001.
Published Online: June 22, 2011
... ball grid arrays copper alloys lead alloys printed circuits reflow soldering reliability silver alloys solders thermal stress cracking tin alloys backward compatible mixed solder lead-free thermal cycling A large number of high reliability microelectronics applications...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041001.
Published Online: November 19, 2010
... activation energy eutectic alloys interface phenomena lead alloys silver alloys solders surface roughness tin alloys wetting zinc alloys 01 02 2010 03 10 2010 19 11 2010 19 11 2010 Arrhenius plot for the spreading of the Sn–37Pb solder 2010 American...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031008.
Published Online: September 9, 2010
... underfilled with one of five different materials after soldering with SnCu, SAC305, and SnPb. adhesion copper alloys flip-chip devices lead alloys reliability solders stress analysis thermal expansion thermal shock tin alloys So far, flip chip assembly is exempt from the requirement...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011016.
Published Online: February 25, 2009
... estimates of the actual fatigue curves. 29 10 2007 05 12 2008 25 02 2009 durability fatigue integrated circuit interconnections lead alloys solders tin alloys vibrations Vibration loading is commonly encountered during the service life of electronic products...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 120–128.
Published Online: October 4, 2006
... lead alloys tin alloys plasticity eutectic alloys indentation elastic deformation plastic deformation hardness testing integrated circuit packaging 16 06 2005 04 10 2006 The current study is motivated by the trend of miniaturization of microelectronics solder...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 195–204.
Published Online: June 23, 2006
... lead alloys fractography Many factors can affect the service reliability of a solder joint ( 1 ). Solder microstructure, soldering defects, cyclic temperature range, peak temperatures, holding time, and loading/unloading rates, are just a few...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 82–89.
Published Online: May 21, 2006
... correlation to the creep deformation and that the correlation is different for lead-free and lead-containing solder alloys. solders electronics packaging creep testing deformation tin alloys lead alloys silver alloys copper alloys Lead-free solder alloys are widely used in solder joints...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 246–250.
Published Online: November 29, 2005
... topography surface morphology adhesion solders scanning electron microscopy X-ray chemical analysis atomic force microscopy focused ion beam technology eutectic alloys lead alloys tin alloys aluminium 03 04 2005 29 11 2005 2006 American Society of Mechanical Engineers ...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 202–207.
Published Online: November 24, 2005
... and electrically ( 1 ). flip-chip devices assembling solders voids (solid) eutectic alloys copper alloys tin alloys lead alloys silver alloys 13 09 2004 24 11 2005 2006 American Society of Mechanical Engineers ...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 440–445.
Published Online: January 4, 2005
... 04 01 2005 solders cooling flip-chip devices melting microassembling directional solidification integrated circuit packaging voids (solid) lead alloys tin alloys silver alloys reflow soldering In a flip chip assembly, the solder joints connecting the chip and its circuit...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 407–414.
Published Online: December 24, 2004
... 2004 electronics packaging fatigue testing solders life testing shear strength creep testing ductility tin alloys lead alloys Solders have been used as a connection material between electric parts. They receive low cycle fatigue damage during on/off switching caused...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 308–316.
Published Online: October 6, 2004
... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received June 2003; final revision, February 2004. Associate Editor: D. Agonafer. 01 June 2003 01 February 2004 06 10 2004 copper transient analysis metal foams bismuth alloys tin alloys lead alloys indium alloys heat sinks...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 147–156.
Published Online: September 14, 2004
... Deformation in Solder Joints-Part I: Accumulated Deformation in Surface Mount Joints ,” ASME J. Electron. Packag. 1043-7398 , 113 , pp. 8 – 15 . 13 10 2003 14 09 2004 tin alloys lead alloys eutectic alloys solders electronics packaging viscoelasticity viscoplasticity...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 237–244.
Published Online: May 26, 2004
.... A morrow energy model was examined and found to be a proper low cycle fatigue model for solder joints under mixed mode loading condition. 01 10 2003 26 05 2004 tin alloys lead alloys silver alloys copper alloys solders ball grid arrays printed circuit testing fatigue testing...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 120–126.
Published Online: May 18, 2004
... and thermal conductivity of the joints, degrade the mechanical properties and even induce crack initiation and propagation ( 2 ). The level of understanding about the formation of voids still remains speculative, and very little work has been reported on this subject in the open literature. lead...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 100–105.
Published Online: April 30, 2004
... alloys lead alloys fatigue viscoplasticity creep irreversible thermodynamics failure analysis finite element analysis materials testing failure (mechanical) 01 June 2001 01 October 2003 30 04 2004 Contributed by the Electronic and Photonic Packaging Division...