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Keywords: microstructure
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031008.
Paper No: EP-23-1044
Published Online: March 13, 2024
... to characterize the changes in the alloy phases during testing. Microstructural analysis indicates that Indalloy 236 can experience void coalescence at high temperatures while Indalloy 264 precipitates antimony-rich phases on the grain boundaries. 1 Corresponding author. e-mail:  daniel.young@wright.edu...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031005.
Paper No: EP-22-1066
Published Online: January 27, 2023
... used affects the fatigue performance of the SAC solder alloys. Figure 20 depicts the interfacial microstructures of SC305 with the OSP and ENIG surface finishes. Regardless of the surface finish, Sn and Ag in the SAC305 solder alloy form Ag 3 Sn particles. They were distributed as networks in the β...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021007.
Paper No: EP-22-1044
Published Online: September 28, 2022
... 16 08 2022 28 09 2022 microstructure Sn alloys shear fatigue solder joint The electronics manufacturing has experienced significant material transformation since the adoption of the Directives on Hazardous Materials and Waste Electrical and Electronic Products. Solder...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011002.
Paper No: EP-20-1077
Published Online: August 6, 2021
...Zheng Liu; Li Yang; Yifeng Xiong; Huiming Gao The effect of trace Nb nanoparticles on the thermal properties, wettability, microstructure, and mechanical properties of Sn–0.7Cu solder alloy was investigated. The results showed that the melting temperature of Sn–0.7Cu composite solder alloy...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021002.
Paper No: EP-17-1123
Published Online: March 1, 2019
... balls located at the periphery of the package. Components were then mounted on FR-4 multilayered PCB and subjected to one reflow profile cycle. Cross sections were performed on as-reflowed SAC305 solder balls to observe their initial microstructure and ensure the representativeness of the assembled test...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021005.
Published Online: June 23, 2011
...Chu-Hsuan Sha; Chin C. Lee A fundamental study is carried out to investigate the microstructure and surface treatment possibilities of 304 stainless steel (304SS) substrates. To expose the microstructure, mirror-finished 304SS is applied with a self-mixed etchant containing ammonium sulfite ((NH 4...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021003.
Published Online: June 22, 2011
.... In either case, higher compression pressure is needed to achieve strong bonding. It is also a good idea to increase the Au thickness to reduce the shear strain. SEM images showing the microstructure of Au layer deposited on Si/Cr by E-beam evaporation: ( a ) low magnification and ( b ) high...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011006.
Published Online: February 12, 2009
...Dapeng Zhu; Xiaoqin Lin; Le Luo The aim of this work is to evaluate the changes in microstructures and electrical properties of a tantalum nitride (Ta–N) thin film integrated on an aluminum anodization multichip module deposited (MCM-D) substrate. A Ta–N resistor with a thickness of 100 nm...