...Tzer-Ming Jeng; Li-Kang Liu; Ying-Huei Hung A novel semi-empirical model with an improved single blow method for exploring the heat transfer performance of porous aluminum-foam heat sinks in a channel has been successfully developed. The influencing parameters such as the steady-state air...

... packaging metallisation thermal conductivity finite element analysis stress analysis thermal expansion substrates modelling internal stresses Semiconductor laser diodes are the primary components of various optoelectronic applications. Unlike the ordinary semiconductors, a laser...

...A. Tava´rez; J. E. Gonza´lez The development of a mathematical model of the soldering process of actual pastes as used in surface mount technology (SMT) lines is described in this paper. The coupled heat transfer processes between the solder paste and the flux including changes in solder paste...

... and their geometries are suitable for two-dimensional (2-D) finite element (FE) simulation. This choice is not so clear in PBGAs. In this study, sectional 2-D, sliced three-dimensional (3-D), and 1/8th 3-D FE models for PBGA assemblies are compared to determine the appropriate FE models that are able to save...

...Octavio Leon; Gilbert De Mey; Erik Dick; Jan Vierendeels The performance of an array of staggered and nonstaggered cooling fins is compared, looking not only into the traditional objective of maximum heat transfer flux, but also to obtain it with the minimum flow resistance. Three different models...

...Hong Tang; Cemal Basaran, Mem. ASME, Associate Professor and Director, A thermomechanical fatigue life prediction model based on the theory of damage mechanics is presented. The damage evolution, corresponding to the material degradation under cyclic thermomechanical loading, is quantified...

... with material constants C = 5.54 , β = − 1.38 was fitted from the combination of the lifetime measured and the shear plastic strain range simulated by 3-D model. In the case with underfill, the plastic strain of every solder joint becomes very similar and little dependent on the position of solder joints...