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Keywords: stress effects
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Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041007.
Published Online: October 29, 2009
... technology finite elements stress analysis micromechanics elastic moduli finite element analysis gold integrated circuit bonding integrated circuit interconnections stress effects ultrasonic bonding 12 07 2008 16 09 2009 29 10 2009 2009 American Society of Mechanical...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 195–204.
Published Online: June 23, 2006
... is presented in the next section. Creep in the biaxial stress condition still needs further investigation. The axial stress effects on the shearing deformation behavior of the Pb-free SAC 387 and Sn – Pb eutectic alloys at shearing strain rates of 1.3...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 398–405.
Published Online: October 6, 2004
... packaging life testing solders electronics packaging cracks stress effects finite element analysis There are many types of thermal fatigue models for determining the solder joint reliability of electronic packages, each with its own merits 1 . These models are dependent on package-level...
Journal Articles
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2002, 124(4): 317.
Published Online: December 12, 2002
...Bernd Michel,, Guest Editor, Poly’2000 Co-chair; Kikuo Kishimoto,, Guest Editor, Poly’2000 Co-chair 12 12 2002 reliability polymers adhesion adhesives plastic packaging integrated circuit packaging fracture mechanics stress effects thermal management (packaging...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 61–66.
Published Online: December 12, 1999
... received December 12, 1999. Associate Technical Editor: M. Shiratori. 08 November 1999 12 December 1999 packaging thermal stresses delamination cracks stress effects thermal management (packaging) The interfacial stresses are shown in Figs. 2 ( a ) 3 4 ( b...