Experiments were conducted to determine the performance of a system of low-velocity air jets used to cool a simulated electronics package. The test model consisted of a uniform array of rectangular elements mounted to a circuit board. Each element was cooled by a cluster of four jets, and the spent fluid was vented at one end of the channel formed between the circuit board and the plate from which the jets were discharged. Reported are measurements of system pressure drop and convective heat transfer coefficients for elements at various sites within the array. Results indicate that (for the geometry tested) the largest portion of the total pressure drop occurs across the jet orifices. Further, the crossflow of spent air appears to enhance heat transfer for those elements near the exit end of the channel.
Skip Nav Destination
Article navigation
Research Papers
Impingement Cooling of Electronics
B. R. Hollworth,
B. R. Hollworth
Division of Mechanical Engineering, Alfred University, Alfred, NY 14802
Search for other works by this author on:
M. Durbin
M. Durbin
Mechanical Engineering Department, Gonzaga University, Spokane, WA 98124
Search for other works by this author on:
B. R. Hollworth
Division of Mechanical Engineering, Alfred University, Alfred, NY 14802
M. Durbin
Mechanical Engineering Department, Gonzaga University, Spokane, WA 98124
J. Heat Transfer. Aug 1992, 114(3): 607-613 (7 pages)
Published Online: August 1, 1992
Article history
Received:
August 1, 1991
Revised:
February 1, 1992
Online:
May 23, 2008
Connected Content
Citation
Hollworth, B. R., and Durbin, M. (August 1, 1992). "Impingement Cooling of Electronics." ASME. J. Heat Transfer. August 1992; 114(3): 607–613. https://doi.org/10.1115/1.2911324
Download citation file:
Get Email Alerts
Cited By
Entropic Analysis of the Maximum Output Power of Thermoradiative Cells
J. Heat Mass Transfer
Molecular Dynamics Simulations in Nanoscale Heat Transfer: A Mini Review
J. Heat Mass Transfer
Related Articles
Impingement Cooling Flow and Heat Transfer Under Acoustic Excitations
J. Heat Transfer (November,1997)
Cooling of a Multichip Electronic Module by Means of Confined Two-Dimensional Jets of Dielectric Liquid
J. Heat Transfer (November,1990)
Correlating Equations for Impingement Cooling of Small Heat Sources With Single Circular Liquid Jets
J. Heat Transfer (February,1993)
Impingement Cooling of an Isothermally Heated Surface With a Confined Slot Jet
J. Heat Transfer (May,1994)
Related Proceedings Papers
Related Chapters
Radiation
Thermal Management of Microelectronic Equipment
Introduction
Thermal Management of Microelectronic Equipment
Radiation
Thermal Management of Microelectronic Equipment, Second Edition