Quantitative strain analysis (QSA) provides a means for assessing the orientation-dependent micromechanical stress states in bulk polycrystalline materials. When combined with quantitative texture analysis, it facilitates tracking the evolution of micromechanical states associated with selected texture components for specimens deformed in situ. To demonstrate this ability, a sheet specimen of rolled and recrystallized oxygen-free high conductivity Cu was subject to tensile deformation at APS 1-ID-C. Strain pole figures (SPFs) were measured at a series of applied loads, both below and above the onset of macroscopic yielding. From these data, a lattice strain distribution function (LSDF) was calculated for each applied load. Due to the tensorial nature of the LSDF, the full orientation-dependent stress tensor fields can be calculated unambiguously from the single-crystal elastic moduli. The orientation distribution function (ODF) is used to calculate volume-weighted average stress states over tubular volumes centered on the , , and fibers—accounting for of the total volume—are shown as functions of the applied load along [100]. Corresponding weighted standard deviations are calculated as well. Different multiaxial stress states are observed to develop in the crystal subpopulations despite the uniaxial nature of the applied stress. The evolution of the orientation-dependent elastic strain energy density is also examined. The effects of applying stress bound constraints on the SPF inversion are discussed, as are extensions of QSA to examine defect nucleation and propagation.
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April 2008
Research Papers
Quantitative Stress Analysis of Recrystallized OFHC Cu Subject to Deformation In Situ
Joel V. Bernier,
Joel V. Bernier
Engineering Technologies Division,
e-mail: bernier2@llnl.gov
Lawrence Livermore National Laboratory
, B141/R1114, L-229, Livermore, CA 94551
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Matthew P. Miller,
Matthew P. Miller
Sibley School of Mechanical and Aerospace Engineering,
e-mail: mpm4@cornell.edu
Cornell University
, 195 Rhodes Hall, Ithaca, NY 14853
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Jun-Sang Park,
Jun-Sang Park
Sibley School of Mechanical and Aerospace Engineering,
e-mail: jp118@cornell.edu
Cornell University
, 195 Rhodes Hall, Ithaca, NY 14853
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Ulrich Lienert
Ulrich Lienert
Advanced Photon Source,
e-mail: lienert@aps.anl.gov
Argonne National Laboratory
, B431/A007, Argonne, IL 60439
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Joel V. Bernier
Engineering Technologies Division,
Lawrence Livermore National Laboratory
, B141/R1114, L-229, Livermore, CA 94551e-mail: bernier2@llnl.gov
Matthew P. Miller
Sibley School of Mechanical and Aerospace Engineering,
Cornell University
, 195 Rhodes Hall, Ithaca, NY 14853e-mail: mpm4@cornell.edu
Jun-Sang Park
Sibley School of Mechanical and Aerospace Engineering,
Cornell University
, 195 Rhodes Hall, Ithaca, NY 14853e-mail: jp118@cornell.edu
Ulrich Lienert
Advanced Photon Source,
Argonne National Laboratory
, B431/A007, Argonne, IL 60439e-mail: lienert@aps.anl.gov
J. Eng. Mater. Technol. Apr 2008, 130(2): 021021 (11 pages)
Published Online: March 28, 2008
Article history
Received:
August 8, 2007
Revised:
January 23, 2008
Published:
March 28, 2008
Citation
Bernier, J. V., Miller, M. P., Park, J., and Lienert, U. (March 28, 2008). "Quantitative Stress Analysis of Recrystallized OFHC Cu Subject to Deformation In Situ." ASME. J. Eng. Mater. Technol. April 2008; 130(2): 021021. https://doi.org/10.1115/1.2870234
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